| Effects of AlN Content and Sintering Atmospheres on the
Thermal Conductivity of Hot-Pressed SiC Ceramics |
Jingren Li,a, b, * Wenzhong Lua, b and Hai Jiangc
pages : 193-198
DOI : 10.1080/0371750X.2021.1952110 |
| Abstract |
| In pursuit of high thermal conductivity of SiC ceramics, this article reports the effects
of AlN and sintering atmospheres on the thermal properties and microstructure
evolution of SiC ceramics. Dense SiC ceramics with different contents of AlN additive
were fabricated through hot-press sintering at 1950oC in Ar/N2 atmosphere under a
pressure of 40 MPa for 3 h. The results showed that the thermal conductivity of samples
without AlN addition was 53.5 W.m–1.K–1 when sintered in Ar and 50.3 W.m–1.K–1 when
sintered in N2. The SiC ceramics with 4 wt% AlN sintered in Ar showed abnormally
large grains and exhibited the highest thermal conductivity of 121.7 W.m–1.K–1 among
all the samples. The sample with 2 wt% AlN sintered in N2 exhibited a thermal
conductivity of 108.6 W.m–1.K–1; the thermal conductivity deceased with the increasing
AlN content afterwards. Such a decreasing trend of thermal conductivity was attributed
to the ascending 2Hss content and smaller grains of ceramics. There existed an optimal
content of AlN and a proper sintering atmosphere for perfecting the microstructure
and the thermal conductivity of SiC ceramics.
[Keywords: Silicon carbide, Aluminium nitride, Thermal conductivity, Sintering
atmospheres] |
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