| Thermophysical Properties of Ti3SiC2 MAX Phase
Composites with SiC Reinforcement |
Shipra Bajpai, Beihai Ma and Dileep Singh*
Pages : 29-33
DOI : 10.1080/0371750X.2025.2470465 |
| Abstract |
| In the present work, dense (~100%) Ti3SiC2 composites (TSC) are processed along
with 20 vol% of SiC reinforcement (TSC20) via spark plasma sintering at 1400oC, 40
MPa, 15 min, and dynamic vacuum environment. Thermal expansion of both the
composites increases from RT to 1273 K and linear fitting of data yields coefficient of
thermal expansion (CTE) of 9.410–6 K–1 for TSC which decreases to 8.310–6 K–1 for
TSC20. With increase in temperature from RT to 773 K, specific heat for both TSC and
TSC20 composites is observed to increase from 598-850 J.kg–1.K–1, whereas thermal
diffusivity and thermal conductivity values decrease with testing temperature. SiC
reinforcement in Ti3SiC2 resulted in improved thermal diffusivity from 12.7 to 18.7
mm2.s–1 and thermal conductivity from ~57 to ~79 W.m–1.K–1 at RT. However, with
increase in temperature (773 K), thermal diffusivity and conductivity decrease, and
values get closer for both TSC and TSC20 composites. Further extrapolation of thermal
conductivity data showed cross-over at ~973 K due to domination of phonon-phonon
scattering and thus lower values of thermal conductivity for TSC20 than TSC. Therefore,
reduced CTE and higher thermal conductivity of TSC20 make it a viable choice for
applications in high temperatures. |
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