| Joining of Alumina Ceramics to Metal
by Solution Metallization Process |
SUBRATA DAs*. A. N. TIWARI**, A. R. KuLKARNI**, T. S. SYUNRY*
Pages : 212-216
DOI : 10.1080/0371750X.1995.10804722 |
| Abstract |
| Ultra high vacuum (UHV) joining between alumina ceramics
and metal is the key to the success of many devices
used in modern technology. The conventional processes like
high-temperature Sintered Metal Powder Process (SMPP)
and active metal brazing are capital intensive and are not
suitable for custom made items where the requirement of
the product is smaU. ln such l:ases, solution metallization is
an easy and economic altern&tive. Over a decade we have
perfected this method for the fabrication of high-tech UHV
device like Linac. Though this process requires only 1050"C
vis-a-vis 1500°C for SMPP, performance-wise ceramic to
metal seals made by solution metallization are comparable
to or in some respect better than those obtained by other
established processes. The bond quality is dependent upon
several process parameters. A systematic investigation has
been performed to find out the etTect of diffet:"ent process
parameters like pretreatment of ceramic, paint composition,
metallization temperature, time and atmosphere on
ultimate bond strength. Bonding mechanism is also
discussed with the help of the re1>ults of XRD and
microstructural studies. |
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