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Transactions of the INDIAN CERAMIC SOCIETY   Vol. 47  1988
Toughness of Reaction Bonded Silicon Nitride*
A. K. MuKHOPADHYAY AND D. CHAKRABORTY
Pages : 36-42
DOI : 10.1080/0371750X.1988.10822883
Abstract
Influence of density, Youngs modulus, temperature and other experimental variables on strength and fracture toughness of reaction bonded silicon nitride (RBSN) was studied. Fractographic study was made to identify the nature of flaws. The density dependence of strength could be expressed through proposed empirical equations. Strength of RBSN was proportional to Youngs modulus. In the range RT-1400°C some RBSN had constant strength, while others had a peak in strength at 1200°C followed by degradation at 1400°C. The density dependence of fracture toughness could be expressed through some equations. Fracture toughness of RBSN had direct dependence on strength and Youngs modulus. High temperature fracture toughness and strength were directly dependent on each other. Fracture toughness of RBSN at RT increased as notch tip radius was increased in the range 79-225 fm, but it did not show any systematic variation as the normalized notch length was varied.
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